Slice Engineering Copperhead C-E Heat Break

$31.99

Part of the DDX phase 2 upgrade for Creality Ender & CR-10(S). This bi metallic heat break adapts a Slice Engineering Copperhead hot end to the factory heat sink of your Creality machine.

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Slice Engineering Copperhead C-E Heat Break

Part of the DDX phase 2 upgrade for Creality Ender & CR-10(S). This bi metallic heat break adapts a Slice Engineering Copperhead hot end to the factory heat sink of your Creality machine.

Compatibility

This Heat Break is compatible with:

  • Creality Ender-3
  • Creality Ender-3 Pro
  • Creality Ender-5
  • Creality Ender-5 Pro
  • Creality Ender-5 Plus
  • Creality CR-10
  • Creality CR-10 Mini
  • Creality CR-10S
  • Creality CR-10 S4
  • Creality CR-10 S5

Materials Technology

This Bimetallic Copperhead™ Heat Break is made with:

  • Stainless Steel
  • Copper alloy

Rated up to 450 °C

Bi-metallic Technology

Product is supplied with a W2S (Tungsten Disulfide) plated Stainless Steel and Copper Heat break. Some images attached may show the un-plated Copper Heat Break.

Problem Solving Heat Break

The Copperhead™ is a low-cost, open-source hotend option that can handle the heat — heat creep, that is. Replace your factory model hotend with the Copperhead™, to upgrade your 3D printer’s performance and reduce jamming, giving you a smooth print every time.

Advanced Materials Technology

Unlike most materials, plastics don’t have a clean transition from solid to liquid during melting. As filament moves through the hotend, it heats up and reaches the material’s glass transition temperature (Tg), entering a semi-solid, semi-liquid, “gooey” state. While in this state, the plastic responds to applied forces like a wet noodle, causing undesirable print effects like reduction in resolution, blobbing and jamming. An efficient heat break narrows the physical distance during which the plastic is at it’s Tg, and thus improves 3D printer performance. The Bimetallic Heat Break™ from Slice Engineering® is the only heat break designed through the use of thermal imaging to optimize heat transfer.

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